Specification
Processor
• 6th Generation Intel® Skylake Core™ i7/i5/i3 H-series Processor
• Package type: FCBGA1440
Memory
• 2 x DDR4 2133 SO-DIMM up to 32 GB
Chipset
• Mobile Intel® QM170 chipset
Real Time Clock
• Chipset integrated RTC with onboard lithium battery
Watchdog Timer
• Generates a system reset with internal timer for 1min/s ~ 255min/s
Serial ATA Interface
• 3 x SATAIII interface up to 600MB/s.(Only for SATA3)
Display port interface
• Onboard Display port connector
Integrated Graphics
• Intel® 9th Gen integrated HD Graphics
LVDS Interface
• Onboard 24-bit dual channel LVDS interface
CRT Interface
• Onboard 2x8 pin-header
DVI Interface
• Onboard 20-pin DVI interface
Audio Interface
• Realtek ALC262 HD Audio
LAN Interface
• 1 x Intel® I210-AT Gigabit LAN
• 1 x Intel® I219-LM Gigabit LAN (Support iAMT11.0)
GPIO Interface
• Onboard programmable 8-bit digital I/O interface
Extended Interface
• 1 x Mini-PCIe socket (support mSATA), 1 x Sim slot, 1 x Half Size Mini-PCIe socket
Expansion Interface
• Support backplane for 1 x PCIE X16 slot, 1 x PCIE X4 slot or 4 x PCIE X1 slot (optional)
Internal I/O Port
• 1 x RS232/422/485, 5 x RS232, 1 x SMBUS, 1 x GPIO, 4 x USB3.0, 4 x USB2.0, 1 x CRT, 2 x DVI, 1 x LPC, 1 x LVDS, 1 x LCD inverter, 3 x Serial ATA3 and 1 x Audio
External I/O Port
• 2 x LAN, 1 x DisplayPort and 1 x PS/2
Power Requirement
• Standard 24-pin ATX power from Backplane
Mechanical & Environment
Form Factor
168 mm x 126 mm (L x W)
Operation temperature
Operating within 0 ~ 60°C (32°F ~ 140°F)
-10°C to 60°C (14° F to 140° F) (Dual Core)
Storage temperature
-20°C to 80°C (-4° F to 176° F)
Relative humidity
10% to 90% (Non-Condensing)